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In the high-stakes high-precision semiconductor packaging landscape, the production of Front Opening Unified Pods (FOUPs) has evolved far beyond basic plastic fabrication. These specialized carriers are indispensable to automated fabrication facilities (fabs), serving as the primary wafer transport solutions for the secure handling of 300 mm wafers.

Chuan Lih Fa (CLF) Machinery Works Co. Ltd, a decades-old global manufacturer of diverse plastic injection molding machines, has lately made a breakthrough with their Two Platen Injection Molding Machine. CLF’s R&D team has successfully improved the cooling system and developed a multi-circular system, which resulted in an exceptionally high-speed cycle time.

In view of the fact that CLF has clients all over the world and cooperations with Injection Molding Machinery businesses in more than 80 countries/regions, they have actively participated in exhibitions from Southeast Asia, China and Germany. Although CLF will not be able to attend exhibitions this year due to the pandemic, this challenging situation did not prevent CLF to keep on providing solutions and support to its current and potential clients.